(module B1,27 (layer F.Cu) (tedit 0)
  (descr "<b>TEST PAD</b>")
  (fp_text reference A1 (at 1.524 0 -180) (layer F.SilkS)
    (effects (font (size 0.7239 0.7239) (thickness 0.130302)) (justify left bottom))
  )
  (fp_text value TPB1,27 (at -0.635 0.762 -180) (layer F.Fab)
    (effects (font (size 0.77216 0.77216) (thickness 0.138988)) (justify left bottom))
  )
  (fp_line (start -0.635 0) (end 0.635 0) (layer Dwgs.User) (width 0.0024))
  (fp_line (start 0 -0.635) (end 0 0.635) (layer Dwgs.User) (width 0.0024))
  (fp_text user >TP_SIGNAL_NAME (at -0.635 1.905) (layer Dwgs.User)
    (effects (font (size 0.95 0.95) (thickness 0.08)) (justify left bottom))
  )
  (pad TP smd roundrect (at 0 0) (size 1.27 1.27) (layers F.Cu F.Mask) (roundrect_rratio 0.5)
    (solder_mask_margin 0.0635))
)
